Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung. Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectronics Reliability, 43(6):925-934, 2003. [doi]
@article{ZhengLLWH03,
title = {Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls},
author = {Po-Jen Zheng and J. Z. Lee and K. H. Liu and J. D. Wu and S. C. Hung},
year = {2003},
doi = {10.1016/S0026-2714(03)00072-6},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00072-6},
tags = {C++, reliability},
researchr = {https://researchr.org/publication/ZhengLLWH03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {6},
pages = {925-934},
}