Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls

Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung. Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectronics Reliability, 43(6):925-934, 2003. [doi]

Abstract

Abstract is missing.