The following publications are possibly variants of this publication:
- Stacked solder bumping technology for improved solder joint reliabilityXingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard. mr, 41(12):1979-1992, 2001. [doi]
- Effect of substrate flexibility on solder joint reliabilityXingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard. mr, 42(12):1883-1891, 2002. [doi]
- Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packagesYi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang. mr, 46(2-4):386-399, 2006. [doi]