Impact of TSV on TDDB Performance of Neighboring FinFET with HK/IL Gate Stacking

H. Zheng, Y. S. Sun, J.-L. Huang. Impact of TSV on TDDB Performance of Neighboring FinFET with HK/IL Gate Stacking. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 4, IEEE, 2022. [doi]

Abstract

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