Changle Zhi, Gang Dong, Deguang Yang, Daihang Liu, Yinghao Feng, Yang Wang, Zhangming Zhu. Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits. IEEE Trans. VLSI Syst., 33(3):627-637, March 2025. [doi]
Abstract is missing.