Low-temperature direct and indirect bonding using plasma activation for 3D integration - researchr publication authors

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Shicheng Zhou, Xiaoyun Qi, Qiushi Kang, Chenxi Wang. Low-temperature direct and indirect bonding using plasma activation for 3D integration. In 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020. pages 130-132, IEEE, 2020. [doi]

This author has not been identified. Look up 'Shicheng Zhou' in GoogleThis author has not been identified. Look up 'Xiaoyun Qi' in GoogleThis author has not been identified. Look up 'Qiushi Kang' in GoogleThis author has not been identified. Look up 'Chenxi Wang' in Google

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