Shicheng Zhou, Xiaoyun Qi, Qiushi Kang, Chenxi Wang. Low-temperature direct and indirect bonding using plasma activation for 3D integration. In 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020. pages 130-132, IEEE, 2020. [doi]
Abstract is missing.