Shicheng Zhou, Xiaoyun Qi, Qiushi Kang, Chenxi Wang. Low-temperature direct and indirect bonding using plasma activation for 3D integration. In 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020. pages 130-132, IEEE, 2020. [doi]
@inproceedings{ZhouQKW20,
title = {Low-temperature direct and indirect bonding using plasma activation for 3D integration},
author = {Shicheng Zhou and Xiaoyun Qi and Qiushi Kang and Chenxi Wang},
year = {2020},
doi = {10.1109/ICTA50426.2020.9331985},
url = {https://doi.org/10.1109/ICTA50426.2020.9331985},
researchr = {https://researchr.org/publication/ZhouQKW20},
cites = {0},
citedby = {0},
pages = {130-132},
booktitle = {2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020},
publisher = {IEEE},
isbn = {978-1-7281-8032-8},
}