Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration - researchr publication authors

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Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun 0003, Min Yu, Jing Chen, Min Miao, Yufeng Jin. Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. In 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013. pages 155-158, IEEE, 2013. [doi]

This author has not been identified. Look up 'Zhiyuan Zhu' in GoogleThis author has not been identified. Look up 'Shaonan Wang' in GoogleThis author has not been identified. Look up 'Yichao Xu' in GoogleThis author has not been identified. Look up 'Guanjiang Wang' in GoogleThis author has not been identified. Look up 'Yudan Pi' in GoogleThis author has not been identified. Look up 'Peiquan Wang' in GoogleThis author has not been identified. Look up 'Yunhui Zhu' in GoogleThis author has not been identified. Look up 'Xin Sun 0003' in GoogleThis author has not been identified. Look up 'Min Yu' in GoogleThis author has not been identified. Look up 'Jing Chen' in GoogleThis author has not been identified. Look up 'Min Miao' in GoogleThis author has not been identified. Look up 'Yufeng Jin' in Google

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