Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun 0003, Min Yu, Jing Chen, Min Miao, Yufeng Jin. Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. In 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013. pages 155-158, IEEE, 2013. [doi]
@inproceedings{ZhuWXWPWZ0YCMJ13,
title = {Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration},
author = {Zhiyuan Zhu and Shaonan Wang and Yichao Xu and Guanjiang Wang and Yudan Pi and Peiquan Wang and Yunhui Zhu and Xin Sun 0003 and Min Yu and Jing Chen and Min Miao and Yufeng Jin},
year = {2013},
doi = {10.1109/NEMS.2013.6559703},
url = {http://dx.doi.org/10.1109/NEMS.2013.6559703},
researchr = {https://researchr.org/publication/ZhuWXWPWZ0YCMJ13},
cites = {0},
citedby = {0},
pages = {155-158},
booktitle = {8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013},
publisher = {IEEE},
}