Zhen Zhuang, Bei Yu 0001, Kai-Yuan Chao, Tsung-Yi Ho. Multi-Package Co-Design for Chiplet Integration. In Tulika Mitra, Evangeline Young, Jinjun Xiong, editors, Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022, San Diego, California, USA, 30 October 2022 - 3 November 2022. pages 114, ACM, 2022. [doi]
Abstract is missing.