Multi-Product Optimization for 3D Heterogeneous Integration with D2W Bonding

Zhen Zhuang, Kai-Yuan Chao, Bei Yu 0001, Tsung-Yi Ho, Martin D. F. Wong. Multi-Product Optimization for 3D Heterogeneous Integration with D2W Bonding. In IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023. pages 1-9, IEEE, 2023. [doi]

Abstract

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