Karl F. Zimmermann. SiPROBE - A New Technology for Wafer Probing. In Proceedings IEEE International Test Conference 1995, Driving Down the Cost of Test, Washington, DC, USA, October 21-25, 1995. pages 106-112, IEEE Computer Society, 1995.
@inproceedings{Zimmermann95:1,
title = {SiPROBE - A New Technology for Wafer Probing},
author = {Karl F. Zimmermann},
year = {1995},
researchr = {https://researchr.org/publication/Zimmermann95%3A1},
cites = {0},
citedby = {0},
pages = {106-112},
booktitle = {Proceedings IEEE International Test Conference 1995, Driving Down the Cost of Test, Washington, DC, USA, October 21-25, 1995},
publisher = {IEEE Computer Society},
isbn = {0-7803-2992-9},
}