Thermomechanical stress-aware management for 3D IC designs - researchr publication authors

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Qiaosha Zou, Tao Zhang, Eren Kursun, Yuan Xie. Thermomechanical stress-aware management for 3D IC designs. In Enrico Macii, editor, Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013. pages 1255-1258, EDA Consortium San Jose, CA, USA / ACM DL, 2013. [doi]

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