Qiaosha Zou, Tao Zhang, Eren Kursun, Yuan Xie. Thermomechanical stress-aware management for 3D IC designs. In Enrico Macii, editor, Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013. pages 1255-1258, EDA Consortium San Jose, CA, USA / ACM DL, 2013. [doi]
@inproceedings{ZouZKX13, title = {Thermomechanical stress-aware management for 3D IC designs}, author = {Qiaosha Zou and Tao Zhang and Eren Kursun and Yuan Xie}, year = {2013}, url = {http://dl.acm.org/citation.cfm?id=2485589}, researchr = {https://researchr.org/publication/ZouZKX13}, cites = {0}, citedby = {0}, pages = {1255-1258}, booktitle = {Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013}, editor = {Enrico Macii}, publisher = {EDA Consortium San Jose, CA, USA / ACM DL}, isbn = {978-1-4503-2153-2}, }