Michael Buttrick, Sandip Kundu. Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by Multiplexing TSVs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2011, 4-6 July 2011, Chennai, India. pages 194-199, IEEE Computer Society, 2011. [doi]
Abstract is missing.