Y.-L. Shen - researchr alias

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Viewing Publication 1 - 10 from 10

2016

Numerical study of microbump failure in 3D microelectronic structuresY.-L. Shen, G. C. Flores, J. Guthrie. mr, 61:48-55, 2016. [doi]

2013

Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessmentY.-L. Shen, R. W. Johnson. mr, 53(1):79-89, 2013. [doi]

The annealing effect of chemical vapor deposited grapheneY.-L. Shen, P. Zhou, L.-H. Wang, Q. Q. Sun, Q. Q. Tao, P. F. Wang, S. J. Ding, D. W. Zhang. asicon 2013: 1-4 [doi]

2012

Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packagingE. J. Cheng, Y.-L. Shen. mr, 52(3):534-540, 2012. [doi]

2011

Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloysH. X. Xie, N. Chawla, Y.-L. Shen. mr, 51(6):1142-1147, 2011. [doi]

2010

Numerical study of ductile failure morphology in solder joints under fast loading conditionsY.-L. Shen, K. Aluru. mr 2010: 2059-2070 [doi]

Numerical study of ductile failure morphology in solder joints under fast loading conditionsY.-L. Shen, K. Aluru. mr, 50(12):2059-2070, 2010. [doi]

2008

Optimal Fusion Reduced-Order Kalman estimators for discrete-Time stochastic singular SystemsShu-Li Sun, Y.-L. Shen, Jing Ma. cis, 36(1), 2008. [doi]

2007

On the failure path in shear-tested solder jointsW. H. Moy, Y.-L. Shen. mr, 47(8):1300-1305, 2007. [doi]

2002

Analysis of thermal stresses in metal interconnects with multilevel structuresM. S. Kilijanski, Y.-L. Shen. mr, 42(2):259-264, 2002. [doi]

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