| 4 | -- | 6 | Jörg Henkel. Three-Dimensional Integrated Circuits |
| 7 | -- | 8 | Daehyun Kim, Sung Kyu Lim. Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools - Part 2 |
| 9 | -- | 16 | Shi-Yu Huang, Meng-Ting Tsai, Kun-Han Tsai, Wu-Tung Cheng. Delay Characterization and Testing of Arbitrary Multiple-Pin Interconnects |
| 17 | -- | 29 | Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim. High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs |
| 30 | -- | 39 | Bing-Yang Lin, Wan-Ting Chiang, Cheng-Wen Wu, Mincent Lee, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Configurable Cubical Redundancy Schemes for Channel-Based 3-D DRAM Yield Improvement |
| 40 | -- | 48 | Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi. Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks |
| 49 | -- | 58 | Hari Chauhan, Marvin Onabajo, Vladimir Kvartenko, Robin Coxe, Theophane Weber. An Optimization Platform for Digital Predistortion of Power Amplifiers |
| 59 | -- | 67 | Florian Kriebel, Muhammad Shafique, Semeen Rehman, Jörg Henkel, Siddharth Garg. Variability and Reliability Awareness in the Age of Dark Silicon |
| 68 | -- | 75 | Vivek De. Energy-Efficient Computing in Nanoscale CMOS |
| 76 | -- | 96 | Sandip Ray, Yier Jin, Arijit Raychowdhury. The Changing Computing Paradigm With Internet of Things: A Tutorial Introduction |
| 97 | -- | 98 | Rolf Ernst. Report of the 2015 Embedded Systems Week (ESWEEK) |
| 101 | -- | 102 | Theo Theocharides. Test Technology TC Newsletter |
| 104 | -- | 0 | Scott Davidson. The Five Stages of Project Grief |