Journal: IEEE Design & Test of Computers

Volume 33, Issue 6

4 -- 0Jörg Henkel. Best in Test
5 -- 6Nicola Nicolici, Haralampos-G. D. Stratigopoulos. Guest Editors' Introduction: Top Papers from the 2015 International Test Conference
7 -- 14Cesar Acero, Derek Feltham, Marek Patyra, Friedrich Hapke, Elham K. Moghaddam, Nilanjan Mukherjee, Vidya Neerkundar, Janusz Rajski, Jerzy Tyszer, Justyna Zawada. On New Test Points for Compact Cell-Aware Tests
15 -- 22Masahiro Ishida, Kiyotaka Ichiyama. An ATE System for Testing RF Digital Communication Devices With QAM Signal Interfaces
23 -- 30Shi-Yu Huang, Chih-Chieh Cheng, Meng-Ting Tsai, Kuan-Chen Huang, Kun-Han Tsai, Wu-Tung Cheng. Versatile Transition-Time Monitoring for Interconnects via Distributed TDC
31 -- 37Kelly A. Ockunzzi, Michael R. Ouellette, Kevin W. Gorman. Practical Application of RAM Sequential Test
38 -- 45Stephen Sunter, J.-F. Cote, Jeff Rearick. Streaming Access to ADCs and DACs for Mixed-Signal ATPG
46 -- 54Manuel J. Barragan, Haralampos-G. D. Stratigopoulos, Salvador Mir, Hervé Le Gall, Neha Bhargava, Ankur Bal. Practical Simulation Flow for Evaluating Analog/Mixed-Signal Test Techniques
55 -- 62Eshan Singh, David Lin, Clark Barrett, Subhasish Mitra. Symbolic Quick Error Detection for Pre-Silicon and Post-Silicon Validation: Frequently Asked Questions
63 -- 71Kai-Hui Chang, Hong-Zu Chou, Haiqian Yu, Dylan Dobbyn, Sy-Yen Kuo. Handling Nondeterminism in Logic Simulation so That Your Waveform Can Be Trusted Again
72 -- 76Bahadir Tunaboylu. Power Delivery Performance of Probe Test Systems for Semiconductor Wafers
77 -- 84Syed Azhar Ali Zaidi, Abuduwaili Tuoheti, Maurizio Martina, Guido Masera. FPGA Accelerator of Algebraic Quasi Cyclic LDPC Codes for nand Flash Memories
85 -- 92Abbas Rahimi, Luca Benini, Rajesh K. Gupta. CIRCA-GPUs: Increasing Instruction Reuse Through Inexact Computing in GP-GPUs
93 -- 94Vijay Raghunathan, Muhammad M. Khellah. Recap of the 2016 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2016)
95 -- 0Misha Temkin. The 2016 DAC Art Show Winner: Misha Temkin
96 -- 0Ron Press, Li-C. Wang. ITC and the Future of Test - We've Won

Volume 33, Issue 5

4 -- 0Jörg Henkel. New Directions in Analog/Mixed-Signal Design and Test
5 -- 6Xin Li, Chandramouli Kashyap, Chris J. Myers. Guest Editors' Introduction Challenges and Opportunities in Analog/Mixed-Signal CAD
7 -- 15Anirudh Iyengar, Swaroop Ghosh, Srikant Srinivasan. Retention Testing Methodology for STTRAM
16 -- 27Jiho Lee, Jaeha Kim. Efficient Global Optimization of Analog Circuits Using Predictive Response Surface Models on Discretized Design Space
28 -- 34Parijat Mukherjee, Peng Li. Using Presilicon Knowledge to Excite Nonlinear Failure Modes in Large Mixed-Signal Circuits
35 -- 43Hafiz ul Asad, Kevin D. Jones. Verifying Inevitability of Oscillation in Ring Oscillators Using the Deductive SOS-QE Approach
44 -- 55Vladimir Dubikhin, Danil Sokolov, Alex Yakovlev, Chris J. Myers. Design of Mixed-Signal Systems With Asynchronous Control
56 -- 64Kai He, Xin Huang, Sheldon X.-D. Tan. EM-Based On-Chip Aging Sensor for Detection of Recycled ICs
65 -- 74Rolf Ernst, Marco Di Natale. Mixed Criticality Systems - A History of Misconceptions?
75 -- 83Farshad Khorrami, Prashanth Krishnamurthy, Ramesh Karri. Cybersecurity for Control Systems: A Process-Aware Perspective
84 -- 91Magdy Abadir. Creating a Successful Partnership Between Industry, Academia, and Government
93 -- 95Chuck Alpert. Recap of the 53rd Design Automation Conference (DAC)
101 -- 103Theo Theocharides. Test Technology TC Newsletter
104 -- 0Scott Davidson. Where Are We Going?

Volume 33, Issue 4

4 -- 5Jörg Henkel. Designing and Testing Implantable Medical Devices
6 -- 7Mohamad Sawan, Shuenn-Yuh Lee. Guest Editors' Introduction: Implantable Medical Devices
8 -- 23Xiao Liu, Zhulin Zong, Dai Jiang, Bachir Bougaila, Nick Donaldson, Andreas Demosthenous. Advances in Scalable Implantable Systems for Neurostimulation Using Networked ASICs
24 -- 36Xingyuan Tong, Maysam Ghovanloo. Multichannel Wireless Neural Recording AFE Architectures: Analysis, Modeling, and Tradeoffs
37 -- 48Takashi Tokuda, Toshikazu Kawamura, Keita Masuda, Tomohiro Hirai, Hironari Takehara, Yasumi Ohta, Mayumi Motoyama, Hiroaki Takehara, Toshihiko Noda, Kiyotaka Sasagawa, Jun Ohta, Teru Okitsu, Shoji Takeuchi. In Vitro Long-Term Performance Evaluation and Improvement in the Response Time of CMOS-Based Implantable Glucose Sensors
49 -- 60Robert Rieger, Shi-Hao Ou. Pulse-Width-Modulating Biosignal ADC for Rapid ASIC Design and IP Core Reuse
61 -- 73Paul Jung-Ho Lee, Amine Bermak, Man Kay Law, Jun Ohta. A Multichannel Power-Supply-Modulated Microstimulator With Energy Recycling
74 -- 81Ruben Cubo, Alexander Medvedev, Mattias Åström. Model-Based Optimization of Individualized Deep Brain Stimulation Therapy
82 -- 91Senthil Arasu, Mehrdad Nourani, John M. Carulli, Vijay Reddy. Controlling Aging in Timing-Critical Paths
92 -- 108Samarjit Chakraborty, Mohammad Abdullah Al Faruque, Wanli Chang, Dip Goswami, Marilyn Wolf, Qi Zhu. Automotive Cyber-Physical Systems: A Tutorial Introduction
109 -- 113Marilyn Wolf. Ultralow Power and the New Era of Not-So-VLSI
114 -- 117Luca Fanucci, Jürgen Teich. Recap of the 2016 DATE Conference & Exhibition
124 -- 126Theo Theocharides. Test Technology TC Newsletter
128 -- 0Scott Davidson. The Intestinal Superhighway

Volume 33, Issue 3

4 -- 5Jörg Henkel. Robustness for 3-D Circuits - Industrial Perspectives
6 -- 7Saqib Khursheed, Pascal Vivet, Fabian Hopsch, Erik Jan Marinissen. Guest Editors' Introduction: Robust 3-D Stacked ICs
8 -- 20Eric Beyne. The 3-D Interconnect Technology Landscape
21 -- 36Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy. Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits
37 -- 45Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne. Reliability Challenges Related to TSV Integration and 3-D Stacking
46 -- 55Frank Altmann, Matthias Petzold. Innovative Failure Analysis Techniques for 3-D Packaging Developments
56 -- 65Kaushik Roy, Byunghoo Jung, Dimitrios Peroulis, Anand Raghunathan. Integrated Systems in the More-Than-Moore Era: Designing Low-Cost Energy-Efficient Systems Using Heterogeneous Components
66 -- 76Daniela De Venuto, Valerio F. Annese, Michele Ruta, Eugenio Di Sciascio, Alberto L. Sangiovanni-Vincentelli. Designing a Cyber-Physical System for Fall Prevention by Cortico-Muscular Coupling Detection
77 -- 90Qiwu Luo, Yigang He, Yichuang Sun. Real-Time Fault Detection and Diagnosis System for Analog and Mixed-Signal Circuits of Acousto-Magnetic EAS Devices
91 -- 102Georgios Volanis, Angelos Antonopoulos, Alkis A. Hatzopoulos, Yiorgos Makris. Toward Silicon-Based Cognitive Neuromorphic ICs - A Survey
103 -- 115Debdeep Mukhopadhyay. PUFs as Promising Tools for Security in Internet of Things
116 -- 124Andrés Takach. High-Level Synthesis: Status, Trends, and Future Directions
125 -- 132Gabe Moretti. Accellera's DVCon Conferences Focus on the Community of Practicing Engineers
133 -- 134Hidetoshi Onodera. 2016 ASP-DAC
140 -- 141Theo Theocharides. Test Technology TC Newsletter
142 -- 143Mary Jane Irwin, Soha Hassoun. Steven P. Levitan (1950-2016)
144 -- 0Scott Davidson. And He Built a Crooked Chip

Volume 33, Issue 2

4 -- 6Jörg Henkel. Three-Dimensional Integrated Circuits
7 -- 8Daehyun Kim, Sung Kyu Lim. Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools - Part 2
9 -- 16Shi-Yu Huang, Meng-Ting Tsai, Kun-Han Tsai, Wu-Tung Cheng. Delay Characterization and Testing of Arbitrary Multiple-Pin Interconnects
17 -- 29Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim. High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs
30 -- 39Bing-Yang Lin, Wan-Ting Chiang, Cheng-Wen Wu, Mincent Lee, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Configurable Cubical Redundancy Schemes for Channel-Based 3-D DRAM Yield Improvement
40 -- 48Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi. Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks
49 -- 58Hari Chauhan, Marvin Onabajo, Vladimir Kvartenko, Robin Coxe, Theophane Weber. An Optimization Platform for Digital Predistortion of Power Amplifiers
59 -- 67Florian Kriebel, Muhammad Shafique, Semeen Rehman, Jörg Henkel, Siddharth Garg. Variability and Reliability Awareness in the Age of Dark Silicon
68 -- 75Vivek De. Energy-Efficient Computing in Nanoscale CMOS
76 -- 96Sandip Ray, Yier Jin, Arijit Raychowdhury. The Changing Computing Paradigm With Internet of Things: A Tutorial Introduction
97 -- 98Rolf Ernst. Report of the 2015 Embedded Systems Week (ESWEEK)
101 -- 102Theo Theocharides. Test Technology TC Newsletter
104 -- 0Scott Davidson. The Five Stages of Project Grief

Volume 33, Issue 1

4 -- 5Jörg Henkel. Approximate Computing: Solving Computing's Inefficiency Problem?
6 -- 7Qiang Xu, Todd Mytkowicz, Nam Sung Kim. Guest Editors' Introduction: Approximate Computing
8 -- 22Qiang Xu, Todd Mytkowicz, Nam Sung Kim. Approximate Computing: A Survey
23 -- 31Donghwan Jeong, Young H. Oh, Jae W. Lee, Yongjun Park. An eDRAM-Based Approximate Register File for GPUs
32 -- 42Amir Yazdanbakhsh, Bradley Thwaites, Hadi Esmaeilzadeh, Gennady Pekhimenko, Onur Mutlu, Todd C. Mowry. Mitigating the Memory Bottleneck With Approximate Load Value Prediction
43 -- 50Daya Shanker Khudia, Babak Zamirai, Mehrzad Samadi, Scott A. Mahlke. Quality Control for Approximate Accelerators by Error Prediction
51 -- 58Boxun Li, Peng Gu, Yu Wang, Huazhong Yang. Exploring the Precision Limitation for RRAM-Based Analog Approximate Computing
59 -- 67Bruce Querbach, Rahul Khanna, Sudeep Puligundla, David Blankenbeckler, Joseph Crop, Patrick Yin Chiang. Architecture of a Reusable BIST Engine for Detection and Autocorrection of Memory Failures and for IO Debug, Validation, Link Training, and Power Optimization on 14-nm SoC
68 -- 76Can Hankendi, Ayse Kivilcim Coskun, Henry Hoffmann. Adapt&Cap: Coordinating System- and Application-Level Adaptation for Power-Constrained Systems
77 -- 84Shawn Blanton, David Yeh. Test: Wisdom From the Giants, Visions for the Future - Part 2
85 -- 86Bill Eklow. Recap of the ITC15 Test Conference
87 -- 88Frank Liu. From the Heart of Silicon Valley to the Hill Country - Highlights of ICCAD 2015
89 -- 90Radovan Stojanovic, Radenka Krsmanovic Whiffen. Report on MECO'2015
93 -- 94Theo Theocharides. Test Technology TC Newsletter
96 -- 0Scott Davidson. Good Enough Computing