4 | -- | 5 | Jörg Henkel. Robustness for 3-D Circuits - Industrial Perspectives |
6 | -- | 7 | Saqib Khursheed, Pascal Vivet, Fabian Hopsch, Erik Jan Marinissen. Guest Editors' Introduction: Robust 3-D Stacked ICs |
8 | -- | 20 | Eric Beyne. The 3-D Interconnect Technology Landscape |
21 | -- | 36 | Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy. Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits |
37 | -- | 45 | Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne. Reliability Challenges Related to TSV Integration and 3-D Stacking |
46 | -- | 55 | Frank Altmann, Matthias Petzold. Innovative Failure Analysis Techniques for 3-D Packaging Developments |
56 | -- | 65 | Kaushik Roy, Byunghoo Jung, Dimitrios Peroulis, Anand Raghunathan. Integrated Systems in the More-Than-Moore Era: Designing Low-Cost Energy-Efficient Systems Using Heterogeneous Components |
66 | -- | 76 | Daniela De Venuto, Valerio F. Annese, Michele Ruta, Eugenio Di Sciascio, Alberto L. Sangiovanni-Vincentelli. Designing a Cyber-Physical System for Fall Prevention by Cortico-Muscular Coupling Detection |
77 | -- | 90 | Qiwu Luo, Yigang He, Yichuang Sun. Real-Time Fault Detection and Diagnosis System for Analog and Mixed-Signal Circuits of Acousto-Magnetic EAS Devices |
91 | -- | 102 | Georgios Volanis, Angelos Antonopoulos, Alkis A. Hatzopoulos, Yiorgos Makris. Toward Silicon-Based Cognitive Neuromorphic ICs - A Survey |
103 | -- | 115 | Debdeep Mukhopadhyay. PUFs as Promising Tools for Security in Internet of Things |
116 | -- | 124 | Andrés Takach. High-Level Synthesis: Status, Trends, and Future Directions |
125 | -- | 132 | Gabe Moretti. Accellera's DVCon Conferences Focus on the Community of Practicing Engineers |
133 | -- | 134 | Hidetoshi Onodera. 2016 ASP-DAC |
140 | -- | 141 | Theo Theocharides. Test Technology TC Newsletter |
142 | -- | 143 | Mary Jane Irwin, Soha Hassoun. Steven P. Levitan (1950-2016) |
144 | -- | 0 | Scott Davidson. And He Built a Crooked Chip |