| 4 | -- | 0 | Partha Pratim Pande. Special Issue on Design and Test of Multidie Packages |
| 5 | -- | 6 | Adam Cron, Hailong Jiao, Erik Jan Marinissen. Guest Editors' Introduction: Special Issue on Design and Test of Multidie Packages |
| 7 | -- | 16 | Teresa McLaurin, Adam Cron. Applying IEEE Test Standards to Multidie Designs |
| 17 | -- | 25 | Jean-François Côté, Jeff Fan, Sean Shen, Givargis Danialy 0001, Marcin Lipinski, Michael Garbers, Wu Yang, Martin Keim, Andreas Glowatz, Joe Reynick, Ayush Patel, Joanna Michna. Affordable and Comprehensive Testing of 3-D Stacked Die Devices |
| 26 | -- | 33 | Chen Wei, Xiaole Cui, Xiaoxin Cui. A Global Self-Repair Method for TSV Arrays With Adaptive FNS-CAC Codec |
| 34 | -- | 42 | Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen. Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement |
| 43 | -- | 53 | Roman Pawelczyk, Damian Grzechca. Improvement of Functional Safety of the Level-Crossing Barrier Machine by a Noninvasive Angle-Detection Method |
| 54 | -- | 61 | Donghyun Kang, Soonhoi Ha. Datapath Extension of NPUs to Support Nonconvolutional Layers Efficiently |
| 62 | -- | 69 | Nhat-An Nguyen, Hien Vu, Massoud Pedram, Donghwa Shin. An Attachable Battery-Supercapacitor Hybrid for Large Pulsed Load |
| 70 | -- | 78 | Andrew B. Kahng, Minsoo Kim, Seungwon Kim, Mingyu Woo. RosettaStone: Connecting the Past, Present, and Future of Physical Design Research |
| 79 | -- | 87 | Kazuki Monta, Leonidas Katselas, Ferenc Fodor, Takuji Miki, Alkis A. Hatzopoulos, Makoto Nagata, Erik Jan Marinissen. Testing Embedded Toggle Generation Through On-Chip IR-Drop Measurements |
| 88 | -- | 97 | Marshal Raj, Raja Sekar Kumaresan, G. Lakshminarayanan. Majority-Logic-Based Self-Checking Adder in Quantum-Dot Cellular Automata |
| 98 | -- | 0 | Scott Davidson. Standing on the Shoulders of .. |