Journal: IEEE Micro

Volume 39, Issue 6

4 -- 5Lizy Kurian John. 3-D Chips! Chips are Getting Denser and Taller Than Ever!!
6 -- 7Vijaykrishnan Narayanan. Going Vertical: The Future of Electronics
8 -- 15Suman Datta, Sourav Dutta, Benjamin Grisafe, Jeff Smith, Srivatsa Srinivasa, Huacheng Ye. Back-End-of-Line Compatible Transistors for Monolithic 3-D Integration
16 -- 27Mindy D. Bishop, H.-S. Philip Wong, Subhasish Mitra, Max M. Shulaker. Monolithic 3-D Integration
28 -- 37Zhixiao Zhang, Xin Si, Srivatsa Srinivasa, Akshay Krishna Ramanathan, Meng-Fan Chang. Recent Advances in Compute-in-Memory Support for SRAM Using Monolithic 3-D Integration
38 -- 45Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto GarcĂ­a Ortiz, Sung Kyu Lim. A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology
46 -- 53Itir Akgun, Dylan C. Stow, Yuan Xie 0001. Network-on-Chip Design Guidelines for Monolithic 3-D Integration
54 -- 63Shihui Yin, Jae-sun Seo, Yulhwa Kim, Xu Han, Hugh J. Barnaby, Shimeng Yu, Yandong Luo, Wangxin He, Xiaoyu Sun, Jae-Joon Kim. Monolithically Integrated RRAM- and CMOS-Based In-Memory Computing Optimizations for Efficient Deep Learning
64 -- 72Meenatchi Jagasivamani, Candace Walden, Devesh Singh, Luyi Kang, Shang Li, Mehdi Asnaashari, Sylvain Dubois, Bruce Jacob, Donald Yeung. Analyzing the Monolithic Integration of a ReRAM-Based Main Memory Into a CPU's Die
73 -- 81Marco Donato, Lillian Pentecost, David Brooks 0001, Gu-Yeon Wei. MEMTI: Optimizing On-Chip Nonvolatile Storage for Visual Multitask Inference at the Edge
82 -- 84Shane Greenstein. Antitrust in Three Acts