Journal: Proceedings of the IEEE

Volume 112, Issue 8

950 -- 953Yang Yang 0034, Manos M. Tentzeris. Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing
954 -- 999Yang Yang 0034, Zhiwei Yin, Xuyi Zhu, Hani Al Jamal, Xiaojing Lv, Kexin Hu, Marvin Joshi, Nathan Wille, Mengze Li 0005, Bing Zhang, Zhen Luo, Shlomo Magdassi, Manos M. Tentzeris. A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation
1000 -- 1032Eiyong Park, MinJae Lee, Heijun Jeong, Ratanak Phon, Kyounghwan Kim, Seyeon Park, Sungjoon Lim. 3-D/4-D-Printed Reconfigurable Metasurfaces for Controlling Electromagnetic Waves
1033 -- 1050Geng-Bo Wu, Jin Chen, Chenfeng Yang, Ka Fai Chan, Mu Ku Chen, Din Ping Tsai, Chi Hou Chan. 3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications
1051 -- 1064Hervé Aubert, Dominique Henry, Patrick Pons. 3-D Printing and Gallium-Based Liquid Metal Technologies for Microwave and Millimeter-Wave Components
1065 -- 1090Valentina Palazzi, Federico Alimenti, Leonardo Pierantozzi, Matteo Ribeca, Leonardo Balocchi, Luca Valentini, Silvia Bittolo Bon, Paolo Mezzanotte, Manos M. Tentzeris, Luca Roselli. Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing