A 1.17pJ/b 25Gb/s/pin ground-referenced single-ended serial link for off- and on-package communication in 16nm CMOS using a process- and temperature-adaptive voltage regulator

John M. Wilson 0002, Walker J. Turner, John W. Poulton, Brian Zimmer, Xi Chen, Sudhir S. Kudva, Sanquan Song, Stephen G. Tell, Nikola Nedovic, Wenxu Zhao, Sunil R. Sudhakaran, C. Thomas Gray, William J. Dally. A 1.17pJ/b 25Gb/s/pin ground-referenced single-ended serial link for off- and on-package communication in 16nm CMOS using a process- and temperature-adaptive voltage regulator. In 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018, San Francisco, CA, USA, February 11-15, 2018. pages 276-278, IEEE, 2018. [doi]

Authors

John M. Wilson 0002

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Walker J. Turner

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John W. Poulton

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Brian Zimmer

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Xi Chen

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Sudhir S. Kudva

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Sanquan Song

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Stephen G. Tell

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Nikola Nedovic

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Wenxu Zhao

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Sunil R. Sudhakaran

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C. Thomas Gray

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William J. Dally

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