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Through silicon via to FinFET noise coupling in 3-D integrated circuits

A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, M. Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, P. Absil. Through silicon via to FinFET noise coupling in 3-D integrated circuits. In 2015 International Conference on IC Design & Technology, ICICDT 2015, Leuven, Belgium, June 1-3, 2015. pages 1-4, IEEE, 2015. [doi]

Authors

A. Rouhi Najaf Abadi

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W. Guo

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X. Sun

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K. Ben Ali

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Jean-Pierre Raskin

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M. Rack

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C. Roda Neve

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M. Choi

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V. Moroz

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Geert Van der Plas

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Ingrid De Wolf

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Eric Beyne

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P. Absil

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