Through silicon via to FinFET noise coupling in 3-D integrated circuits

A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, M. Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, P. Absil. Through silicon via to FinFET noise coupling in 3-D integrated circuits. In 2015 International Conference on IC Design & Technology, ICICDT 2015, Leuven, Belgium, June 1-3, 2015. pages 1-4, IEEE, 2015. [doi]

Abstract

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