A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, M. Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, P. Absil. Through silicon via to FinFET noise coupling in 3-D integrated circuits. In 2015 International Conference on IC Design & Technology, ICICDT 2015, Leuven, Belgium, June 1-3, 2015. pages 1-4, IEEE, 2015. [doi]
@inproceedings{AbadiGSARRNCMPW15,
title = {Through silicon via to FinFET noise coupling in 3-D integrated circuits},
author = {A. Rouhi Najaf Abadi and W. Guo and X. Sun and K. Ben Ali and Jean-Pierre Raskin and M. Rack and C. Roda Neve and M. Choi and V. Moroz and Geert Van der Plas and Ingrid De Wolf and Eric Beyne and P. Absil},
year = {2015},
doi = {10.1109/ICICDT.2015.7165916},
url = {http://dx.doi.org/10.1109/ICICDT.2015.7165916},
researchr = {https://researchr.org/publication/AbadiGSARRNCMPW15},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2015 International Conference on IC Design & Technology, ICICDT 2015, Leuven, Belgium, June 1-3, 2015},
publisher = {IEEE},
isbn = {978-1-4799-7669-0},
}