A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs

Nima Aghaee, Zebo Peng, Petru Eles. A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs. J. Electronic Testing, 31(5-6):503-523, 2015. [doi]

@article{AghaeePE15-2,
  title = {A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs},
  author = {Nima Aghaee and Zebo Peng and Petru Eles},
  year = {2015},
  doi = {10.1007/s10836-015-5541-5},
  url = {http://dx.doi.org/10.1007/s10836-015-5541-5},
  researchr = {https://researchr.org/publication/AghaeePE15-2},
  cites = {0},
  citedby = {0},
  journal = {J. Electronic Testing},
  volume = {31},
  number = {5-6},
  pages = {503-523},
}