Reuse-Based Optimization for Prebond and Post-Bond Testing of 3-D-Stacked ICs

Mukesh Agrawal, Krishnendu Chakrabarty, Randy Widialaksono. Reuse-Based Optimization for Prebond and Post-Bond Testing of 3-D-Stacked ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 34(1):122-135, 2015. [doi]

@article{AgrawalCW15,
  title = {Reuse-Based Optimization for Prebond and Post-Bond Testing of 3-D-Stacked ICs},
  author = {Mukesh Agrawal and Krishnendu Chakrabarty and Randy Widialaksono},
  year = {2015},
  doi = {10.1109/TCAD.2014.2369747},
  url = {http://dx.doi.org/10.1109/TCAD.2014.2369747},
  researchr = {https://researchr.org/publication/AgrawalCW15},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
  volume = {34},
  number = {1},
  pages = {122-135},
}