Fabrication and characterization of robust through-silicon vias for silicon-carrier applications - researchr publication authors

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Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer. Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM Journal of Research and Development, 52(6):571-581, 2008. [doi]

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