Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer. Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM Journal of Research and Development, 52(6):571-581, 2008. [doi]
@article{AndryTWSWDM08,
title = {Fabrication and characterization of robust through-silicon vias for silicon-carrier applications},
author = {Paul S. Andry and Cornelia K. Tsang and Bucknell C. Webb and Edmund J. Sprogis and Steven L. Wright and Bing Dang and Dennis G. Manzer},
year = {2008},
doi = {10.1147/JRD.2008.5388558},
url = {http://dx.doi.org/10.1147/JRD.2008.5388558},
tags = {C++},
researchr = {https://researchr.org/publication/AndryTWSWDM08},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {52},
number = {6},
pages = {571-581},
}