Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim. Stress-driven 3D-IC placement with TSV keep-out zone and regularity study. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 669-674, IEEE, 2010. [doi]
@inproceedings{AthikulwongseCYPL10,
title = {Stress-driven 3D-IC placement with TSV keep-out zone and regularity study},
author = {Krit Athikulwongse and Ashutosh Chakraborty and Jae-Seok Yang and David Z. Pan and Sung Kyu Lim},
year = {2010},
doi = {10.1109/ICCAD.2010.5654245},
url = {http://dx.doi.org/10.1109/ICCAD.2010.5654245},
researchr = {https://researchr.org/publication/AthikulwongseCYPL10},
cites = {0},
citedby = {0},
pages = {669-674},
booktitle = {2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA},
publisher = {IEEE},
}