Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim. Stress-driven 3D-IC placement with TSV keep-out zone and regularity study. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 669-674, IEEE, 2010. [doi]
Abstract is missing.