Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim. Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement. IEEE Trans. VLSI Syst., 22(10):2145-2155, 2014. [doi]

Authors

Krit Athikulwongse

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Mongkol Ekpanyapong

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Sung Kyu Lim

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