Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim. Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement. IEEE Trans. VLSI Syst., 22(10):2145-2155, 2014. [doi]
@article{AthikulwongseEL14,
title = {Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement},
author = {Krit Athikulwongse and Mongkol Ekpanyapong and Sung Kyu Lim},
year = {2014},
doi = {10.1109/TVLSI.2013.2285593},
url = {http://dx.doi.org/10.1109/TVLSI.2013.2285593},
researchr = {https://researchr.org/publication/AthikulwongseEL14},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {22},
number = {10},
pages = {2145-2155},
}