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Myat Thu Linn Aung, Takefumi Yoshikawa, Chuan Seng Tan, Tony Tae-Hyoung Kim. Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs. IEEE Trans. VLSI Syst., 25(3):1023-1031, 2017. [doi]
Abstract is missing.