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Intel® Omni-path Architecture: Enabling Scalable, High Performance Fabrics

Mark S. Birrittella, Mark Debbage, Ram Huggahalli, James Kunz, Tom Lovett, Todd Rimmer, Keith D. Underwood, Robert C. Zak. Intel® Omni-path Architecture: Enabling Scalable, High Performance Fabrics. In 23rd IEEE Annual Symposium on High-Performance Interconnects, HOTI 2015, Santa Clara, CA, USA, August 26-28, 2015. pages 1-9, IEEE, 2015. [doi]

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Mark S. Birrittella

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Mark Debbage

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Ram Huggahalli

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James Kunz

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Tom Lovett

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Todd Rimmer

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Keith D. Underwood

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Robert C. Zak

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