Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development - researchr publication authors

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E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, Jérôme Dechamp, Marc Zussy, G. Mauguen, C. Castan, L. Sanchez, Amadine Jouve, F. Fournel, Séverine Cheramy. Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-5, IEEE, 2019. [doi]

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