Wenwen Chai, Dan Jiao. Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects. In Leon Stok, Nikil D. Dutt, Soha Hassoun, editors, Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011. pages 206-211, ACM, 2011. [doi]
Abstract is missing.