3DICE: 3D IC cost evaluation based on fast tier number estimation

Cheng-Chi Chan, Yen-Ting Yu, Iris Hui-Ru Jiang. 3DICE: 3D IC cost evaluation based on fast tier number estimation. In Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011. pages 50-55, IEEE, 2011. [doi]

Authors

Cheng-Chi Chan

This author has not been identified. Look up 'Cheng-Chi Chan' in Google

Yen-Ting Yu

This author has not been identified. Look up 'Yen-Ting Yu' in Google

Iris Hui-Ru Jiang

This author has not been identified. Look up 'Iris Hui-Ru Jiang' in Google