Cheng-Chi Chan, Yen-Ting Yu, Iris Hui-Ru Jiang. 3DICE: 3D IC cost evaluation based on fast tier number estimation. In Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011. pages 50-55, IEEE, 2011. [doi]
@inproceedings{ChanYJ11,
title = {3DICE: 3D IC cost evaluation based on fast tier number estimation},
author = {Cheng-Chi Chan and Yen-Ting Yu and Iris Hui-Ru Jiang},
year = {2011},
doi = {10.1109/ISQED.2011.5770702},
url = {http://dx.doi.org/10.1109/ISQED.2011.5770702},
tags = {rule-based},
researchr = {https://researchr.org/publication/ChanYJ11},
cites = {0},
citedby = {0},
pages = {50-55},
booktitle = {Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011},
publisher = {IEEE},
isbn = {978-1-61284-914-0},
}