3DICE: 3D IC cost evaluation based on fast tier number estimation

Cheng-Chi Chan, Yen-Ting Yu, Iris Hui-Ru Jiang. 3DICE: 3D IC cost evaluation based on fast tier number estimation. In Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011. pages 50-55, IEEE, 2011. [doi]

Abstract

Abstract is missing.