Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings

Quan Chen, Hoi Wai Choi, Ngai Wong. Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings. IEEE Trans. on CAD of Integrated Circuits and Systems, 28(11):1654-1665, 2009. [doi]

Authors

Quan Chen

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Hoi Wai Choi

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Ngai Wong

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