Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings

Quan Chen, Hoi Wai Choi, Ngai Wong. Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings. IEEE Trans. on CAD of Integrated Circuits and Systems, 28(11):1654-1665, 2009. [doi]

Abstract

Abstract is missing.