Quan Chen, Hoi Wai Choi, Ngai Wong. Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings. IEEE Trans. on CAD of Integrated Circuits and Systems, 28(11):1654-1665, 2009. [doi]
@article{ChenCW09-2,
title = {Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings},
author = {Quan Chen and Hoi Wai Choi and Ngai Wong},
year = {2009},
doi = {10.1109/TCAD.2009.2030408},
url = {http://dx.doi.org/10.1109/TCAD.2009.2030408},
researchr = {https://researchr.org/publication/ChenCW09-2},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {28},
number = {11},
pages = {1654-1665},
}