A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers

Chien-Chang Chen, Wai-Kei Mak. A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers. In Fumiyasu Hirose, editor, Proceedings of the 2006 Conference on Asia South Pacific Design Automation: ASP-DAC 2006, Yokohama, Japan, January 24-27, 2006. pages 777-782, IEEE, 2006. [doi]

Abstract

Abstract is missing.