Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao. Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. VLSI Syst., 28(2):421-432, 2020. [doi]
@article{ChenTSPTM20,
title = {Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires},
author = {Liang Chen and Sheldon X.-D. Tan and Zeyu Sun and Shaoyi Peng and Min Tang and Junfa Mao},
year = {2020},
doi = {10.1109/TVLSI.2019.2940197},
url = {https://doi.org/10.1109/TVLSI.2019.2940197},
researchr = {https://researchr.org/publication/ChenTSPTM20},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {28},
number = {2},
pages = {421-432},
}