3D-IC BISR for stacked memories using cross-die spares - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Chun-Chuan Chi, Yung-Fa Chou, Ding-Ming Kwai, Yu-Ying Hsiao, Cheng-Wen Wu, Yu-Tsao Hsing, Li-Ming Denq, Tsung-Hsiang Lin. 3D-IC BISR for stacked memories using cross-die spares. In Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012. pages 1-4, IEEE, 2012. [doi]

This author has not been identified. Look up 'Chun-Chuan Chi' in GoogleThis author has not been identified. Look up 'Yung-Fa Chou' in GoogleThis author has not been identified. Look up 'Ding-Ming Kwai' in GoogleThis author has not been identified. Look up 'Yu-Ying Hsiao' in GoogleThis author has not been identified. Look up 'Cheng-Wen Wu' in GoogleThis author has not been identified. Look up 'Yu-Tsao Hsing' in GoogleThis author has not been identified. Look up 'Li-Ming Denq' in GoogleThis author has not been identified. Look up 'Tsung-Hsiang Lin' in Google

runs on WebDSL