3D-IC BISR for stacked memories using cross-die spares

Chun-Chuan Chi, Yung-Fa Chou, Ding-Ming Kwai, Yu-Ying Hsiao, Cheng-Wen Wu, Yu-Tsao Hsing, Li-Ming Denq, Tsung-Hsiang Lin. 3D-IC BISR for stacked memories using cross-die spares. In Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012. pages 1-4, IEEE, 2012. [doi]

Abstract

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