Chun-Chuan Chi, Yung-Fa Chou, Ding-Ming Kwai, Yu-Ying Hsiao, Cheng-Wen Wu, Yu-Tsao Hsing, Li-Ming Denq, Tsung-Hsiang Lin. 3D-IC BISR for stacked memories using cross-die spares. In Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012. pages 1-4, IEEE, 2012. [doi]
@inproceedings{ChiCKHWHDL12,
title = {3D-IC BISR for stacked memories using cross-die spares},
author = {Chun-Chuan Chi and Yung-Fa Chou and Ding-Ming Kwai and Yu-Ying Hsiao and Cheng-Wen Wu and Yu-Tsao Hsing and Li-Ming Denq and Tsung-Hsiang Lin},
year = {2012},
doi = {10.1109/VLSI-DAT.2012.6212621},
url = {http://dx.doi.org/10.1109/VLSI-DAT.2012.6212621},
researchr = {https://researchr.org/publication/ChiCKHWHDL12},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012},
publisher = {IEEE},
isbn = {978-1-4577-2080-2},
}