Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

Silke H. Christiansen, Rajendra Singh, Ulrich Gosele. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics. Proceedings of the IEEE, 94(12):2060-2106, 2006. [doi]

Authors

Silke H. Christiansen

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Rajendra Singh

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Ulrich Gosele

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